Non-transferring arc and wire additive manufacturing: microstructure, mechanical properties and bulk texture evolution of deposits

Author:

Pattanayak Suvranshu,Sahoo Susanta Kumar,Sahoo Ananda Kumar,Vinjamuri Raviteja,Dwivedi Pushpendra Kumar

Abstract

Purpose This study aims to demonstrate a modified wire arc additive manufacturing (AM) named non-transferring arc and wire AM (NTA-WAM). Here, the build plate has no electrical arc attachment, and the system’s arc is ignited between tungsten electrode and filler wire. Design/methodology/approach The effect of various deposition conditions (welding voltage, travel speed and wire feed speed [WFS]) on bead characteristics is studied through response surface methodology (RSM). Under optimum deposition condition, a single-bead and thin-layered part is fabricated and subjected to microstructural, tensile testing and X-ray diffraction study. Moreover, bulk texture analysis has been carried out to illustrate the effect of thermal cycles and tensile-induced deformations on fibre texture evolutions. Findings RSM illustrates WFS as a crucial deposition parameter that suitably monitors bead width, height, penetration depth, dilution, contact angle and microhardness. The ferritic (acicular and polygonal) and lath bainitic microstructure is transformed into ferrite and pearlitic micrographs with increasing deposition layers. It is attributed to a reduced cooling rate with increased depositions. Mechanical testing exhibits high tensile strength and ductility, which is primarily due to compressive residual stress and lattice strain development. In deposits, ϒ-fibre evolution is more resilient due to the continuous recrystallisation process after each successive deposition. Tensile-induced deformation mostly favours ζ and ε-fibre development due to high strain accumulations. Originality/value This modified electrode arrangement in NTA-WAM suitably reduces spatter and bead height deviation. Low penetration depth and dilution denote a reduction in heat input that enhances the cooling rate.

Publisher

Emerald

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