Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate

Abstract

Purpose This research aims to provide a theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and V-shaped substrate, which also gives guidance for those complicated welding operation objects in brazing technique. Design/methodology/approach Wetting experiments were performed to measure the contact angles at different temperatures of molten Sn-3.0Ag-0.5Cu wetting on the quartz substrate with an included angle of 90°. According to the experimental results, the theoretical spreading morphology of molten solder on V-shaped substrate at corresponding temperature was simulated by Surface Evolver. Findings The theoretical morphology profiles of the molten solder sitting on the V-shaped substrate are simulated using Surface Evolver when the molten solder reaches spreading equilibrium. The spreading mechanisms as well as the impact of surface tension and gravity on interfacial energy of the molten solder wetting on the V-shaped groove substrate are also discussed where theoretical results agree well with experiment results. The contact area between the gas and liquid phases shows a tendency of first increasing and later decreasing. Otherwise, the spreading distance and the height of the molten solder increases as the droplet volume increases as the included angle and the contact angle are given as constants, and both the interfacial energy and the gravitational energy increase as well. This research has a wide influence on predicting the outcomes in commercial impact and also gives guidance for those complicated welding operation objects in brazing technique. Research limitations/implications It is of very important significance in both science and practice to investigate the differences between the flat surface and V-shaped surface. Some necessary parameters including intrinsic contact angle and surface tension need to be directly measured when the droplet spreads on the flat surface. The relevant simulation conclusions on the inherent characteristics can be given based on these intrinsic parameters. Compared with the flat surface, the V-shaped substrate is chosen for further discuss on the effects of gravity on the droplet spreading behavior and the changes of apparent contact angle which can only occurs as the substrate is inclined. Therefore, this research provides theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and substrate. Practical implications The research is developed for verifying the accuracy of the model built in Surface Evolver. Based on this verified model, other researches on the spreading distance along y-axis and the contact area that are especially difficult to be experimentally measured can be directly simulated by Surface Evolver, which can provides a convenient method to discuss the changes of horizontal spreading distance, droplet height and contact area with increasing the included angle of V-shaped substrate or with increasing the droplet volume. Actually, the modeling results are calculated for supplying the theoretical parameters and technical guidance in the welding process. Social implications This research provides theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and substrate, which has a wide influence on prediction the outcomes in commercial impact and also gives guidance for those complicated welding operation objects in brazing technique. Originality/value Surface Evolver, can also be used to discuss the structure and spreading mechanism of droplets on V-shaped substrates, which have not been discussed before.