Author:
Huang Chien-Yi,Ruano Marvin,Chen Ching-Hsiang,Greene Christopher
Abstract
Purpose
This paper aims to consider the practical production environment of electronics manufacturing industry firms, and the large quantities of information collected on machine processes, testing data and production reports, while simultaneously taking into account the properties of the processing environment, in conducting analysis to obtain valuable information.
Design/methodology/approach
This research constructs a prediction model of the circuit board assembly process yield. A decision tree is used to extract the key attributes. The authors also integrate association rules to determine the relevance of key attributes of undesirable phenomena.
Findings
The results assure the successful application of the methodology by reconfirming the rules for solder skip and short circuit occurrence and their causes.
Originality/value
Measures for improvement are recommended, production parameters determined and debugging suggestions made to improve the process yield when the new process is implemented.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Repeatability analysis of EDXRF equipment for RoHS compliance screening for soldering materials used in PCBA manufacturing,2007
2. Mechanical reliability of solder joints in PCBs assembled in surface mount technology;Soldering & Surface Mount Technology,2016
3. Time-based reflow soldering optimization by using adaptive Kriging-HDMR method;Soldering & Surface Mount Technology,2016
4. Mining association rules from imprecise ordinal data;Fuzzy Sets and Systems,2008
5. Integrating classification and regression tree (CART) with GIS for assessment of heavy metals pollution;Environmental Monitoring and Assessment,2008
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献