High Performance Laminate Systems for High Speed Electronics Applications

Abstract

This paper reviews some of the technology trends making it necessary to take the performance of laminate materials into account when designing and fabricating high speed PWBs. It also reviews the available materials for current matched impedance circuitry and discusses the various combinations of polymer resins and reinforcements used in these applications. Additionally, it provides a look at the new materials technologies being applied to high speed applications and what candidates hold most promise for achieving greater signal speeds via lowered dielectric constant while maintaining the compatibility with existing fabrication processes.