Author:
Liu J.,Boustedt K.,Lai Z.
Abstract
Electronic packaging is increasingly becoming a vital part of the electronics industry, representing a key
barrier to cost reduction and performance improvement. Of all the packaging methods,
flip‐chip technology offers, up to now, the highest packaging density and best electrical
performance. In this paper, flip‐chip test design considerations,
process development and driving forces for adhesive joining and soldering flip‐chip processes
will be given. Reliability test results of flip‐chip interconnection technology using conductive
adhesive joining will also be presented. The electrical contact nature of the adhesive joint will be
elaborated in the light of continuous and static electrical resistance measurement. Future research work directions in flip‐chip joining using eutectic solder and
conductive adhesives on flexible circuits will also be discussed.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
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