Optimizing BGA to PCB interconnections using multi‐depth laser drilled blind vias‐in‐pad-Reference-Cited by-同舟云学术

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Optimizing BGA to PCB interconnections using multi‐depth laser drilled blind vias‐in‐pad

Published:1999-06 Issue:2 Volume:25 Page:31-34
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Burgess Larry W.,Pauri Fabrizio

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference5 articles.

1. Arledge, K. and Swirbel, T. (1998), “Microvias in printed circuit design”, IPC Expo 98, pp. S08‐1‐1‐S08‐1‐8.

2. Bergman, D. (1998,)“Chip carriers made easy ‐ using organic substrates”, IPC Expo 98, pp. S14‐7‐1‐S14‐7‐8.

3. Burgess, L.W. and Madden, P.D. (1998), “Designing and fabricating multi‐depth via‐in‐pad PCBs: Production”, IPC Expo 98, pp. S17‐2‐1‐S17‐2‐4.

4. Dietz, K. (1998), NEMI Roadmap.

5. Mescher, P. and Hand, L. (1997), “The expanding BGA menu”, Surface Mount International 1997.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flip Chip Technology Versus FOWLP;Fan-Out Wafer-Level Packaging;2018

2. An overview of microvia technology;Circuit World;2000-06-01

3. Via Drilling;Excimer Laser Technology

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