Surface evaluation of the silver finishes via sequential electrochemical reduction analysis (SERA)-Reference-Cited by-同舟云学术

Surface evaluation of the silver finishes via sequential electrochemical reduction analysis (SERA)

Published:1999-03-01 Issue:1 Volume:25 Page:59-64
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:

Author:

Bratin P.,Pavlov Michael,Chalyt Gene

Abstract

This paper extends our study of the sequential electrochemical reduction analysis (SERA) technique for evaluation of various alternative finishes and it discusses the application of the SERA technique to assess the surface conditions of the silver finish. The tarnishing products of the silver formed under ambient and artificially created conditions were analyzed, the protective effect of an anti‐ tarnishing film was evaluated, and the influence of the elevated temperatures (reflow) on the stability of the organic inhibitor and the formation of the tarnishing film will be shown.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference13 articles.

1. 1Bratin, P., Pavlov, M. and Chalyt, G., “Study of precious metals coatings using SERA”, Metal Finishing, October 1996, pp. 10‐15.

2. 2Hillman, D., Bratin, P. and Pavlov, M., “Demonstrating the relationship between wirebondability and solderability of various metallic finishes”, Proceedings of the SMI Technical Conference, San Jose, September 1996, pp. 687‐701.

3. 3Milad, G., “Surface finishes: metallic coatings over nickel over copper”, Proceedings of the SMI Technical Conference, San Jose, CA, September 1996, pp. 794‐6.

4. 4DeBiassi, J, “Organic solderability preservatives: benzotriazoles and substituted benzimidazoles”, Proceedings of the SMI Technical Conference, September 1996, pp. 763‐76.

5. 5Tench, D.M., “Solderability assessment via SERA”, Journal of Applied Electrochemistry, Vol. 24, December 1994, pp. 46‐50.

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