Limits of copper plating in high aspect ratio microvias-Reference-Cited by-同舟云学术

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Limits of copper plating in high aspect ratio microvias

Published:1999-06-01 Issue:2 Volume:25 Page:35-40
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:

Author:

Castaldi Steve,Fritz Dennis,Schaeffer Ron

Abstract

This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference2 articles.

1. Durso, F., Castaldi, S. and Fritz, D. (1997, “Plated conductor characteristics: microvias made by laser ablation of screen printed dielectric”, IPC Expo.

2. Schaeffer, R.D. (1997, Laser Micromachining: High Speed Hole Drilling for Electronics Packaging, JPCA.

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