Issues Affecting Early Affordable Access to Leading Electronics Technologies by the US Military and Government-Reference-Cited by-同舟云学术

Issues Affecting Early Affordable Access to Leading Electronics Technologies by the US Military and Government

Published:1996-08 Issue:2 Volume:22 Page:7-15
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Pecht M.G.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference23 articles.

1. Arciszewski, H. and Nutt, D.A.‘Present and Future Programmes Related to High Reliability Parts in Europe’,Proceedings Annual Reliability and Maintainability Symposium(1976).

2. Carruth, T. and Sussman, V.‘Epoxy Pellet Encapsulation for Transistors’,Electronic Packaging and Production, Vol. 3, No. 4, pp. 18‐20, April (1963).

3. Condra, L., O‘Rear, S., Freedman, T., Flancia, L. and Pecht, M.‘Comparison of Plastic and Hermetic Microcircuits Under Temperature’ Cycling and Temperature Humidity Bias’,IEEE CHMT Journal, Vol. 15, No. 5, pp. 1‐11, October (1992).

4. Condra, L.W. and Pecht, M.‘Commercial Microcircuit Options in Military Avionics Systems Demand Reliability’,Defense Electronics, pp. 43‐47, December (1991b).

5. Comparison of electronics-reliability assessment approaches

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