Abstract
This paper presents a non‐linear numerical study to investigate the effect
of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array
(PBGA) packages. The package under investigation was a 225‐pin
full‐grid PBGA assembly. The diagonal cross‐section of the PBGA together
with the printed circuit board (PCB) was modelled by plane‐strain elements.
A uniform thermal loading was applied and the solder joints were stressed due to the mismatch
of coefficient of thermal expansion (CTE) and constructions of the PCB assembly.
The effective stress and accumulated plastic strain of solder balls against various chip
dimensions and substrate thicknesses were evaluated as an index for the reliability of solder
joints. The results of this study are helpful for electronics packaging engineers to optimise the
geometry of plastic ball grid array packages.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference6 articles.
1. 1 Lau, J.H., ‘Thermal Stress and Strain in
Microelectronics Packaging’, Van Nostrand Reinhold, New York (1993).
2. 2Lau, J.H., ‘Ball Grid Array Technology’,McGraw‐Hill, New York (1995).
3. 3Lau, J.H. and Pao, Y.‐H., ‘Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT
Assemblies’,McGraw‐Hill, New York (to be published 1997).
4. 4 Lau, J.H., ‘Solder Joint Reliability of Flip Chip and Plastic Ball
Grid Array Assemblies under Thermal, Mechanical, and Vibration Conditions’, Proceedings IEEE IEMTS, pp. 13‐19 (1995).
5. 5 Lau, J.H.,‘Solder Joint Reliability : Theory and Applications’, Van
Nostrand Reinhold, New York (1991).
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