Galvanic corrosion of electronic material copper coupled silver-coating in electronic systems

Abstract

Purpose The purpose of this study is to provide a theoretical basis for the study of the galvanic corrosion mechanism of copper coupled silver-coating under a thin electrolyte layer in electronic systems. Design/methodology/approach Electrochemical measurements and surface characterizations. Findings The results indicate that the potential difference between copper and silver electrodes first quickly increases, and then reaches a relatively stable and large value with the extension of the immersion time. With the significant increase in the cathode/anode area ratio in electronic systems, the area ratio effect obviously accelerates the corrosion of copper due to the remarkable promotion of the cathode process. For a large cathode/anode area ratio, the galvanic current density always maintains a large value and exhibits an increasing trend with the extension of the immersion time, which is attributed that the area ratio effect reduces the protection of corrosion products. For the same area of cathode and anode, the galvanic current density always maintains a small value with the extension of the immersion time due to a low galvanic effect and protective corrosion products. Practical implications This work provides some information for the establishment of reliably protective measures for electronic systems in service. Social implications This work not only provides some information for the establishment of reliably protective measures for electronic systems in service, but also provides a theoretical basis for the selection of metal materials in microelectronic systems. Originality/value This work provides not only a theoretical basis for the study of the galvanic corrosion mechanism of Cu/Ag under a thin electrolyte layer, but also provides some information for the establishment of reliably protective measures for electronic systems in service.