Blowholing in PTH Solder Fillets

Abstract

The amount of gas blowing into the molten solder in plated‐through‐holes during wave soldering is dependent upon the moisture content of the board and the strength of the copper barrels to withstand the pressure of gas. This strength is dependent, in turn, upon both the thickness of the copper electroplate and the quality of the original electroless copper deposit. The problem of blowholing may be overcome by improving the copper quality and/or by baking the PCB prior to soldering. This paper gives a scientific framework linking the important parameters involved in the control of blowholing. Full data are given to enable the allowable moisture content of a PCB to be calculated in respect of the pressure generated during soldering and of the strength of the copper barrels. If baking is required to attain the required low moisture levels, then certain data are required to quantify the effects of the storage times and the environment conditions between that bake and the subsequent soldering. These data are given.