Influence of firing process quality on dielectric constant of microwave LTCC substrates
Author:
Barteczka Beata,Slobodzian Piotr,Dabrowski Arkadiusz,Golonka Leszek
Abstract
Purpose
– The purpose of this paper was to investigate the influence of non-uniform temperature distribution inside a box furnace during the firing process on electrical properties of the low-temperature co-fired ceramic (LTCC) materials used in radio frequency (RF)/microwave applications.
Design/methodology/approach
– The authors studied the change in dielectric constant of two popular LTCC materials (DP 951 and DP 9K7) depending on the position of their samples inside the box furnace. Before firing of the samples, temperature distribution inside the box furnace was determined. The dielectric constant was measured using the method of two microstrip lines.
Findings
– The findings showed that non-uniform temperature distribution with spatial difference of 6°C can result in 3-4 per cent change of the dielectric constant. It was also found that dielectric constant of the two tested materials shows disparate behavior under the same temperature distribution inside the box furnace.
Practical implications
– The dielectric constant of the substrate materials is crucial for RF/microwave applications. Therefore, it was shown that 3-4 per cent deviation in dielectric constant can result in considerable detuning of microwave circuits and antennas.
Originality/value
– To the best of the authors’ knowledge, the quantitative description of the impact of temperature distribution inside a box furnace on electrical properties of the LTCC materials has never been published in the open literature. The findings should be helpful when optimizing production process for high yield of reliable LTCC components like filters, baluns and chip antennas.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Alias, R.
(2012), “The effects of sintering temperature variations on microstructure changes of ltcc substrate, sintering of ceramics – New Emerging Techniques”, in
Lakshmanan, A.
(Ed), ISBN: 978-953-51-0017-1, InTech, DOI: 10.5772/32873, available at: www.intechopen.com/books/sintering-of-ceramics-new-emerging-techniques/the-effects-of-sintering-temperature-variations-on-microstructure-changes-of-ltcc-substrate 2. Cho, Y.-H.
,
Kim, J.-W.
and
Park, Y.-H.
(2008), “An ultra-miniaturized transceiver module for bluetooth applications using 3-D LTCC system-on-package technology”, IEEE MTT-S International Microwave Symposium Digest, 15-20 June, Atlanta, GA. 3. Choi, Y.-J.
,
Park, J.-H.
,
Park, J.-H.
and
Park, J.-G.
(2004), “Middle-permittivity LTCC dielectric compositions with adjustable temperature coefficient”,
Material Letters
, Vol. 58, pp. 3102-3106. 4. Dai, Y.
,
Yin, H.
,
Feng, Y.
,
Li, P.
,
Han, H.
and
Han, M.
(2012), “A LTCC miniaturized broadband modified Marchand balun”,
Proceedings of the International Symposium on Communications and Information Technologies (ISCIT)
, Gold Coast, QLD. 5. Design and Layouts Guidelines
(2009), “DuPont”, available at: www2.dupont.com/MCM/en_US/assets/downloads/prodinfo/GreenTape_Design_Layout_Guidelines.pdf (accessed 15 July 2013).
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
|
|