Antimicrobial second skin using copper nanomesh

Author:

Kim Jae Joon1,Ha Siyoung2,Kim Lina2,Kato Yutaro1,Wang Yan1ORCID,Okutani Chihiro1ORCID,Wang Haoyang1,Wang Chunya1ORCID,Fukuda Kenjiro3ORCID,Lee Sunghoon1ORCID,Yokota Tomoyuki1ORCID,Kwon Oh Seok24,Someya Takao13ORCID

Affiliation:

1. Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan

2. Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea

3. Center for Emergent Matter Science & Thin-Film Device Laboratory RIKEN 2-1 Hirosawa, Wako, Saitama 351-0198, Japan

4. Department of Nanobiotechnology, Korea University of Science and Technology (UST), Daejeon 34141, South Korea

Abstract

The functional support and advancement of our body while preserving inherent naturalness is one of the ultimate goals of bioengineering. Skin protection against infectious pathogens is an application that requires common and long-term wear without discomfort or distortion of the skin functions. However, no antimicrobial method has been introduced to prevent cross-infection while preserving intrinsic skin conditions. Here, we propose an antimicrobial skin protection platform copper nanomesh, which prevents cross-infectionmorphology, temperature change rate, and skin humidity. Copper nanomesh exhibited an inactivation rate of 99.99% for Escherichia coli bacteria and influenza virus A within 1 and 10 min, respectively. The thin and porous nanomesh allows for conformal coating on the fingertips, without significant interference with the rate of skin temperature change and humidity. Efficient cross-infection prevention and thermal transfer of copper nanomesh were demonstrated using direct on-hand experiments.

Funder

MEXT | JST | Accelerated Innovation Research Initiative Turning Top Science and Ideas into High-Impact Values

Publisher

Proceedings of the National Academy of Sciences

Subject

Multidisciplinary

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