Application of calorimetry on a chip to high-pressure materials-Reference-Cited by-同舟云学术

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Application of calorimetry on a chip to high-pressure materials

Published:2007-05-08 Issue:22 Volume:104 Page:9187-9191
ISSN:0027-8424
Container-title:Proceedings of the National Academy of Sciences
language:en
Short-container-title:Proceedings of the National Academy of Sciences

Author:

Navrotsky A.,Dorogova M.,Hellman F.,Cooke D. W.,Zink B. L.,Lesher C. E.,Boerio-Goates J.,Woodfield B. F.,Lang B.

Publisher

Proceedings of the National Academy of Sciences

Subject

Multidisciplinary

Reference24 articles.

1. Progress and new directions in high temperature calorimetry revisited

2. Negative Pressure-Temperature Slopes for Reactions Formign MgSiO 3 Perovskite from Calorimetry

3. Thin film microcalorimeter for heat capacity measurements from 1.5 to 800 K

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chip-Based Fast Scanning Calorimetry;The Handbook of Differential Scanning Calorimetry;2023

2. Materials properties characterization in the most extreme environments;MRS Bulletin;2022-11

3. Thermodynamic Properties from Adiabatic and Combustion Calorimetry of Two Polycyclic Aromatic Hydrocarbons, Benz[a]anthracene and Chrysene;Journal of Chemical & Engineering Data;2021-09-15

4. Reprint of: Nanocalorimetry: Door opened for in situ material characterization under extreme non-equilibrium conditions;Progress in Materials Science;2021-07

5. Nanocalorimetry: Exploring materials faster and smaller;Applied Physics Reviews;2019-09

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