Rainfall Impacts Winter Wheat Seedling Emergence from Deep Planting Depths
Author:
Affiliation:
1. Dep. of Crop and Soil Sciences Washington State Univ., Dryland Research Station P.O. Box B Lind WA 99341
Funder
Weber State University
Publisher
Wiley
Subject
Agronomy and Crop Science
Link
https://onlinelibrary.wiley.com/doi/pdf/10.2134/agronj2010.0442
Reference25 articles.
1. The impedance of soil seals and the forces of emerging seedlings;Arndt W.;Aust. J. Soil Res.,1965
2. Soil crust and its impact on crop establishment: A review
3. Seedbed Surface Geometry Effects on Soil Crusting and Seedling Emergence
4. Low intensity rainfall with a rotating‐disk simulator;Bubenzer G.D.;Trans. ASAE,1985
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The impacts of temperature averages, variabilities and extremes on China’s winter wheat yield and its changing rate;Environmental Research Communications;2023-07-01
2. Alternative Solution to Synthetic Fertilizers for the Starter Fertilization of Bread Wheat under Mediterranean Climatic Conditions;Agronomy;2022-02-18
3. Comparison of Single-Trait and Multi-Trait Genome-Wide Association Models and Inclusion of Correlated Traits in the Dissection of the Genetic Architecture of a Complex Trait in a Breeding Program;Frontiers in Plant Science;2022-01-28
4. Comparison of genomic selection models for exploring predictive ability of complex traits in breeding programs;The Plant Genome;2021-11
5. Comparison of Single-Trait and Multi-Trait Genome-Wide Association Models and Inclusion of Correlated Traits in the Dissection of the Genetic Architecture of a Complex Trait in a Breeding Program;2021-08-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3