Current Challenges of Agile Hardware Development: What are Still the Pain Points Nowadays?-Reference-Cited by-同舟云学术

Current Challenges of Agile Hardware Development: What are Still the Pain Points Nowadays?

Published:2019-07 Issue:1 Volume:1 Page:2209-2218
ISSN:2220-4342
Container-title:Proceedings of the Design Society: International Conference on Engineering Design
language:en
Short-container-title:Proc. Int. Conf. Eng. Des.

Author:

Atzberger Alexander,Paetzold Kristin

Abstract

AbstractOriginally developed for the software industry, agile development is being applied in the hardware field nowadays as well due to its benefits when having to deal with volatile, uncertain, complex and ambiguous (VUCA) conditions. However, certain complications arise when applying the concept of agility in the hardware. In this publication, based on the challenges identified by Ovesen in 2012, the current challenges of agile development for hardware are gathered using an embedded design approach, ensuring its actuality based on the latest surveys and empirical data. The current state regarding the challenges is displayed and its interrelations as well as their advancements compared to seven years ago is discussed. Moreover, an attempt to explain the difficulties of applying agile development is given by a hardware-related complexity model.

Publisher

Cambridge University Press (CUP)

Subject

General Medicine

Reference26 articles.

1. Ovesen N. and Dowlen C. (2012), “The challenges of becoming agile - experiences from new product development in industry and design education”, 14th International Conference on Engineering and Product Design Education: Design Education for Future Wellbeing, Antwerp, pp. 9–14.

2. Böhmer A. , Beckmann A. and Lindemann U. (2015), “Open innovation ecosystem - makerspaces within an agile innovation process”, in Huizingh E. , Conn S. , Bitran I. (Ed.), Proceedings of the ISPIM Innovation Summit: Changing the Innovation Landscape, The International Society for Innovation Management, Brisbane, pp. 1–11.

3. We.Conect. (2018), Agile PEP Minds Survey 2018, Berlin.

4. Schröder A. and Schrofner A. (2015), “Hochleistung ist crossfunktional”, Der F&E Manager - Für Mehr Effizienz in Der Innovation, pp. 6–13.

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Is Hardware Agile Worth It? - Analyzing the SpaceX Development Process;AIAA SCITECH 2024 Forum;2024-01-04

2. Technological Migration from I3.0 to I4.0 Applying Concurrent Engineering and Adapted Agile Management Methodologies;10th Manufacturing Engineering Society International Conference (MESIC 2023);2023-10-02

3. Distributed Integration of Electronic Control Units for Automotive OEMs: Challenges, Vision, and Research Directions;2023 IEEE 20th International Conference on Software Architecture Companion (ICSA-C);2023-03

4. Product Development Process for complex hardware-based solutions: current trends;Procedia CIRP;2023

5. Why Companies Scale Agile Development of Physical Products: An Empirical Study;Design in the Era of Industry 4.0, Volume 3;2023