Analysis of electroless nickel thin films
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Published:1991-08
Issue:
Volume:49
Page:510-511
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ISSN:0424-8201
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Container-title:Proceedings, annual meeting, Electron Microscopy Society of America
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language:en
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Short-container-title:Proc. annu. meet. Electron Microsc. Soc. Am.
Author:
Price C. W.,Lindsey E. F.
Abstract
Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.
Publisher
Cambridge University Press (CUP)
Reference4 articles.
1. Surface film X-ray microanalysis
2. Dini, J. W. et al. Products Finishing, to be published.
3. Work performed under the auspices of the U. S. Department of Energy by the Lawrence Livermore National Laboratory under Contract #W-7405-ENG-48.
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