Abstract
During the course of structural characterization of nickel electrodeposit, we have found that there are a large number of linear defects which are different from dislocations. This communication reports a detailed analysis of these defects using transmission electron microscopy.Nickel film was prepared by electrodeposition from a bath containing 0.43 M NiSO4-6H2O and 0.5 M H3BO3. The pH of the bath was adjusted to 1.5. A sheet of annealed OFHC copper was used as the substrate. All the platings were carried out at 30°C.Nickel film plated at a current density of 5 MA/cm2 contained these linear Refects. Figures l(a), (b), and (c) show micrographs of the film taken with g = 200, 220, and 131, respectively. The images of the defects are indicated by four fine arrows in Fig. 1(c). They were not easily discernible with low-order g's such as 111, 200, and 220 (see Figs. 1(a) and (b)).
Publisher
Cambridge University Press (CUP)