Abstract
The evaporating meniscus of a perfectly wetting fluid exhibits an apparent contact
angle Θ that is a function of superheat. Existing theory predicts Θ and the heat flow
from the contact region as part of the solution of a free-boundary problem. That
theory admits the possibility that much of the heat flow occurs
at the nanometre scale [lscr ]Θ
at which Θ is determined. Here, the heat flow at that scale is proved negligible in
typical applications. A phenomenological model of the contact region then holds since the
part of the wetting film thinner than [lscr ]Θ can be replaced by an apparent contact line.
Self-consistency arguments are used to derive conditions under which (i) the phase
interface can be taken as linear with assumed contact angle Θ; (ii) the heat flux to the
liquid side of the phase interface is given by Newton's law of cooling with predicted
heat transfer coefficient h; and (iii) the temperature satisfies Laplace's equation within
the phases. When these conditions are met, prediction of the heat flow is decoupled
from the physically non-trivial problem of predicting Θ. Next, this conduction theory
is used to find the heat flow from the contact region of a meniscus on a conductive
slab. The solution depends on Θ, the liquid–solid conductivity ratio
k = K[lscr ]/Ks and a
Biot number [Bscr ] = hd/K[lscr ] based on slab thickness
d. Asymptotic and numerical analysis
is used to find the temperature in the double limit
[Bscr ]−1 → 0 and k → 0. The solution
has an inner-and-outer structure, and properties of the inner region prove universal.
Formulae given here for the heat flow and contact line temperature on a slab thus
apply to more complex geometries. Further, the solution explains the main features
seen in published simulations of evaporation from conductive solids. Near the contact
line, the solid temperature varies rapidly on the scale d of the slab thickness, but
varies slowly with respect to the liquid temperature. The solid temperature thus proves
uniform at the scale on which Θ is determined. Lastly, the quantitative predictions of
the simplified model are verified against both new and published numerical solutions
of the existing theory. In typical applications, the new formulae give the heat flow and
contact line temperature with an error of about 10%. This error is due to the
approximations made to derive the simplified model, rather than to those made to solve it.
Publisher
Cambridge University Press (CUP)
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Cited by
27 articles.
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