1. Electromigration of Cu/low dielectric constant interconnects
2. 41. Hu, C.-K. , Canaperi, D. , Chen, S. T. , et al., Effects of overlayers on electromigration reliability improvement for Cu/low-k interconnects, Proceedings of the IEEE International Reliability Physics Symposium, IRPS (2004), 222–228.
3. Size effect variation of the electrical conductivity of metals;MacDonald;Proceedings of the Royal Society,1950
4. Electromigration: Void Dynamics