AES Studies on the Ti/N Compositionally Gradient Film Deposited onto Ti-6Al-4V Alloy by Reactive DC Sputtering

Abstract

Deposition of Ti/N compositionally gradient film onto Ti-6Al-4V alloy substrates was carried out by reactive DC sputtering, not only to improve the blood compatibility of the alloy but also to relax the stress concentrated at the interface between the film and the alloy substrate. The compositional gradient was realized by varying continuously the nitrogen content in Ar-N2 sputter gas during deposition. In Auger electron spectroscopy (AES) analysis, Auger spectra were acquired in the N(E) mode using the beam brightness modulation (BBM) method to overcome the problem of the peak overlap of the principal Auger nitrogen transition peak (N-KLL) with one of titanium peaks (Ti-LMM). The deposited film appeared to be uniform and adhesive. TiN formation at the surface of the film was assumed, because of its yellow gold color and the X-ray diffraction (XRD) pattern for it. Under scanning electron microscopy, it was found that the surface had fine particles dispersed on a smooth accumulated deposit and that this depositing method improved the structural property of the film at the surface. According to AES in-depth profiles, the nitrogen (N) concentration in the film gradually decreased in the depth direction from the surface toward the alloy, confirming that a Ti/N compositionally gradient film had formed on the alloy substrate.