Author:
Calvez Christophe,Pilard Romain,Person Christian,Coupez Jean-Philippe,Gallée François,Gianesello Frédéric,Ezzeddine Hilal,Gloria Daniel
Abstract
Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.
Publisher
Cambridge University Press (CUP)
Subject
Electrical and Electronic Engineering
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