Future Prospects for Defect and Strain Analysis in the SEM via Electron Channeling

Abstract

Electron diffraction in both SEM and TEM provides a contrast mechanism for imaging defects as well as a means for quantifying elastic strain. Electron backscatter diffraction (EBSD) is the commercially established method for SEM-based diffraction analysis. In EBSD, Kikuchi patterns are acquired by a charge-coupled device (CCD) camera and indexed using commercial software. Phase and crystallographic orientation information can be extracted from these Kikuchi patterns, and researchers have developed cross-correlation methods to measure strain as well.