Effects of PCB surface finishes on the Mechanical and Electrical Reliabilities of Sn-0.7Cu Pb-free Solder Bump-Reference-Cited by-同舟云学术

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Effects of PCB surface finishes on the Mechanical and Electrical Reliabilities of Sn-0.7Cu Pb-free Solder Bump

Published:2015-10-05 Issue:10 Volume:53 Page:735-744
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:
Short-container-title:Korean J. Met. Mater.

Author:

Park Young-Bae,Kim Sung-Hyuk,Lee Byeong-Rok,Park Gyu-Tae,Kim Jae-Myeong,Yoo Se-Hoon

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Au Bump Process Condition on the Interfacial Reaction and Mechanical Reliability of Non-cyanide Au Bump for Display Driver IC Bonding;Korean Journal of Metals and Materials;2024-09-05

2. Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application;Korean Journal of Metals and Materials;2024-04-05

3. Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration;Journal of Welding and Joining;2021-02-28

4. Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump;Electronic Materials Letters;2018-12-12

5. Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump;Korean Journal of Metals and Materials;2017-11-05

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