Effect of Process Parameters on the Angular Distribution of Sputtered Cu Flux in Long-Throw Sputtering System-Reference-Cited by-同舟云学术

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Effect of Process Parameters on the Angular Distribution of Sputtered Cu Flux in Long-Throw Sputtering System

Published:2019-07-05 Issue:7 Volume:57 Page:462-467
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:en
Short-container-title:Korean J. Met. Mater.

Author:

Shin Hee-Young,Kim Tae-Ho,Park Jun-Woo,Sohn Hyun-Chul

Funder

Ministry of Trade, Industry and Energy

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

Link

http://kjmm.org/upload/pdf/kjmm-2019-57-7-462.pdf

Reference24 articles.

1. Process integration for through-silicon vias

2. Titanium sputter deposition at low pressures and long throw distances

3. Directional deposition of Cu into semiconductor trench structures using ionized magnetron sputtering

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Epitaxial Growth of SrMnO3 Films on SrTiO3 Substrates by Off-Axis Angle Radio Frequency Magnetron Sputtering;Science of Advanced Materials;2021-07-01

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