Effect of Gelatin and Chloride Ions on the Mechanical Properties and Microstructural Evolution of Copper Foil-Reference-Cited by-同舟云学术

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Effect of Gelatin and Chloride Ions on the Mechanical Properties and Microstructural Evolution of Copper Foil

Published:2018-07-05 Issue:7 Volume:56 Page:518-523
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:en
Short-container-title:Korean J. Met. Mater.

Author:

Woo Tae-Gyu,Lee Man-Hyung,Seol Kyeong-Won

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

Link

http://kjmm.org/upload/pdf/kjmm-2018-56-7-518.pdf

Reference22 articles.

1. The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil

2. The Influence of Gelatin Additives on the Mechanical Properties of Electrodeposited Cu Thin Films

3. Overview and Future Concerns for Lithium-Ion Batteries Materials

4. Effect of Deposition Conditions on Properties of Cu Thin Films Electrodeposited from Pyrophosphate Baths

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of polymer additive on structural and morphological properties of Cu-electrodeposition from an acid sulfate electrolyte: Experimental and theoretical studies;Journal of Electroanalytical Chemistry;2023-10

2. Effects of DPS on Surface Roughness and Mechanical Properties of Electrodeposited Copper Foils;Crystal Research and Technology;2023-08-16

3. Effects of Additives in an Electrodeposition Bath on the Surface Morphologic Evolution of Electrodeposited Copper;International Journal of Electrochemical Science;2021-02

4. Effects of Gelatin on Electroplated Copper Through the Use of a Modified-Hydrodynamic Electroplating Test Cell;International Journal of Electrochemical Science;2021-02

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