ecovery of Tin and Nitric Acid from Spent Solder Stripping Solutions-Reference-Cited by-同舟云学术

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ecovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

Published:2015-06-05 Issue:6 Volume:53 Page:426-431
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:
Short-container-title:Korean J. Met. Mater.

Author:

Ahn Jae-Woo,Ryu Seong-Hyung,Kim Tae-Young

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of Anion-Exchange Membranes for Diffusion Dialysis of Mixtures of Acids and Their Iron Salts;Membranes;2023-12-24

2. Recovery of metals and valuable chemicals from waste electric and electronic materials: a critical review of existing technologies;RSC Sustainability;2023

3. Treatment of Spent Pickling Solutions by Diffusion Dialysis Using Anion-Exchange Membrane Neosepta-AFN;Membranes;2022-12-21

4. Electrochemical dissolution and recovery of tin from printed circuit board in methane–sulfonic acid solution;Hydrometallurgy;2021-11

5. Recycling Tin from Electronic Waste: A Problem That Needs More Attention;ACS Sustainable Chemistry & Engineering;2017-09-27

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