Interface Microstructure and Deformation Behavior of an Al-Cu Dissimilar Metal Plate-Reference-Cited by-同舟云学术

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Interface Microstructure and Deformation Behavior of an Al-Cu Dissimilar Metal Plate

Published:2013-07-05 Issue:7 Volume:51 Page:535-545
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:
Short-container-title:Korean J. Met. Mater.

Author:

Lee Kwang-Seok,Lee Su-Eun,Kim Jung Su,Kim Min Jung,Bae Dong Hyun,Kwon Yong-Nam

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interface strengthening of a roll-bonded two-ply Al/Cu sheet by short annealing;Materials Characterization;2021-04

2. Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current;Korean Journal of Metals and Materials;2017-06-05

3. The effect of surface preparation on the bond strength of Al-St strips in CRB process;Materials & Design;2016-10

4. Interactive deformation and enhanced ductility of tri-layered Cu/Al/Cu clad composite;Materials Science and Engineering: A;2016-01

5. Analysis of warping during flat rolling of bimetallic slabs;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2015-01-16

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