Properties of Y<sub>2</sub>O<sub>3</sub> Dispersion Strengthened W Fabricated by Ultrasonic Spray Pyrolysis and Pressure Sintering
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Published:2023-03-05
Issue:3
Volume:61
Page:170-174
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ISSN:1738-8228
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Container-title:Korean Journal of Metals and Materials
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language:en
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Short-container-title:Korean J. Met. Mater.
Author:
Lee Eui Seon,Heo Youn Ji,Kim Ji Young,Lee Young-In,Suk Myung-Jin,Oh Sung-Tag
Abstract
The effects of fabrication method on the microstructure and sinterability of W-1 wt% Y<sub>2</sub>O<sub>3</sub> were analyzed. W composite powders dispersed with Y<sub>2</sub>O<sub>3</sub> particles were synthesized by the ultrasonic spray pyrolysis process or the ultrasonic spray pyrolysis/polymer solution process. A dense composite was fabricated by a combination of spark plasma sintering and final hot isostatic pressing. The powder synthesized by the ultrasonic spray pyrolysis had fine dispersed particles on the surface of the cubic powder and was composed of W, Y<sub>2</sub>O<sub>3</sub> and W-oxides. On the other hand, in the case of the ultrasonic spray pyrolysis/polymer solution process, the nano-sized particles formed agglomerates and existed only as pure W and Y<sub>2</sub>O<sub>3</sub> phases. All the sintered compacts treated with HIP showed an increase in relative density, and the sintered compacts of the powder synthesized by the ultrasonic spray pyrolysis/polymer solution process showed a maximum relative density of 97~99% and a fine grain size. The change in microstructure with different powder processing was explained by the presence of W-oxide and the size and distribution of Y<sub>2</sub>O<sub>3</sub> particles. The Vickers hardness of the sintered compact reached the largest value of about 5 GPa in the powder synthesized by the ultrasonic spray pyrolysis/polymer solution process, which was interpreted to be a result of the relatively high density and decreased grain size.
Funder
Seoul National University of Science and Technology
Publisher
The Korean Institute of Metals and Materials
Subject
Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials