Visualization of Joint Behavior during Ultrasonic Flip Chip Bonding Using In-Situ Strain Monitoring Method
Author:
Affiliation:
1. Panasonic Holdings Corporation
2. Panasonic Connect Co., Ltd.
3. Kyushu University
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films
Link
https://www.jstage.jst.go.jp/article/jspmee/11/5/11_202/_pdf
Reference6 articles.
1. M. Hizukuri, Y. Wada, N. Watanabe and T. Asano: “Real Time Measurements of the Strain Generated on Substrate during Ultrasonic Flip Chip Bonding”, Mate2000, (2000), 169-174. (in Japanese)
2. M. Hizukuri, N. Watanabe and T. Asano: “Observation of bump joining behavior during ultrasonic flip chip bonding using minute two-directional strain gauge”, MES2000, (2000), 339-342. (in Japanese)
3. 3) K. Iwanabe, K. Nakadozono, Y. Senda and T. Asano: “Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge”, J. Appl. Phys. 55 (2016), 06GP22.
4. C. S. Smith: “Piezoresistance Effect in Germanium and Silicon”, Phys. Rev. 94-1 (1954), 42-49.
5. K. Nakano: “A Guideline of Machinery Design for Preventing Stickslip”, Journal of Society of Rubber Science and Technology, Japan, 80-4 (2007), 134-139. (in Japanese)
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