Affiliation:
1. Graduate School of Science and Technology, Gunma University
2. YOKOWO Co., Ltd.
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films
Reference11 articles.
1. J. Wang, S. Xue, P. Zhang, P. Zhai and Y. Tao: “The reliability of lead-free solder joint subjected to special environment: a review”, Journal of Materials Science: Materials in Electronics, 30 （2019）, 9065-9086.
2. JIS Z3282: Soft solders - Chemical compositions and forms, （2017） （in Japanese）
3. S. Zhou, O. Mokhtari, M.G. Rafique, V.C. Shunmugasamy, B. Mansoor and H. Nishikawa: “Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition
before and after thermal aging”, Journal of Alloys and Compounds, 765 （2018） 1243-1252.
4. T. Sakai, K. Yasaka, T. Akamatsu, N. Imaizumi, K. Okamoto, S. Sakuyama and K. Uenishi: “Influence of UBM layers on elentromigration behavior of Micro-joints using Sn-Bi eutectic solders”, Proc. of 22nd Symposium on Microelectronics, （2012）, 171-174. （in Japanese）
5. N. Hiyoshi, M. Yamashita and H. Hokazono: “Effect of additive elements on crack initiation and propagation behavior at stress concentration part for Sn-58Bi solders”, Journal of the Society of
Materials Science, 66 （2017）, 173-178. （in Japanese）