Effect of Al Interlayer on Thermal Cycle Reliability for a Semiconductor Die-attached Joint with Ni-Sn Transient Liquid Phase Bonding
Author:
Affiliation:
1. Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Link
https://www.jstage.jst.go.jp/article/jspmee/10/1/10_39/_pdf
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5. G. Zeng, S. McDonald, and K. Nogita: “Development of hightemperature solders: Review”, Microelectronics Reliability, 52-7 （2012）, 1306-1322.
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