LPD 法によるSnO<sub>2</sub> を用いたガラス基板に対する銅めっき皮膜の密着機構

Author:

TSUKUDA Mayu1,NAGAO Toshimitsu1,KATAYAMA Jun-ichi1,HIROOKA Asuka2,SENOO Shunsaku2,HAYAMIZU Masahito2,SAKATA Toshihiko2

Affiliation:

1. Okuno Chemical Industries Co., Ltd.

2. Panasonic Environmental Systems & Engineering Co., Ltd.

Publisher

Sumart Processing Society for Minerals, Environment and Energy

Subject

Industrial and Manufacturing Engineering,Surfaces, Coatings and Films

Reference15 articles.

1. 1) Y. Sato: “Recent Trend of Glass Interposer Development”, Journal of the Surface Finishing Society of Japan, 66-2 (2015), 33-37. (in Japanese)

2. 2) S. Otomo, J. Katayama and M. Izaki: “Formation of Thin Electroless Copper Plating Film with High Adhesion on Glass Substrate Using ZnO by Chemical Deposition”, Proceedings of the Micro-Electronics Symposium, 15 (2005), 393-396. (in Japanese)

3. 3) S. Otomo, J. Katayama and M. Izaki: “Adhesion Improvement by heat treatment of Cu thin film on Glass Substrates with Intermediate Layer of ZnO by Chemical Deposition”, Proceedings of the Micro- Electronics Symposium, 16 (2006), 347-350. (in Japanese)

4. 4) S. Otomo: “Fine Pattern on Glass Substrate”, Journal of the Surface Finishing Society of Japan, 58-12 (2007), 53-57. (in Japanese)

5. 5) S. Deki and M. Mizuhata: “Synthesis of Metal Oxide Films Using Liquid-Phase Deposition Methods”, Electrochemistry, 76-9 (2008), 678-686. (in Japanese)

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