1. 1) Y. Sato: “Recent Trend of Glass Interposer Development”, Journal
of the Surface Finishing Society of Japan, 66-2 (2015), 33-37. (in
Japanese)
2. 2) S. Otomo, J. Katayama and M. Izaki: “Formation of Thin Electroless
Copper Plating Film with High Adhesion on Glass Substrate Using
ZnO by Chemical Deposition”, Proceedings of the Micro-Electronics
Symposium, 15 (2005), 393-396. (in Japanese)
3. 3) S. Otomo, J. Katayama and M. Izaki: “Adhesion Improvement by
heat treatment of Cu thin film on Glass Substrates with Intermediate
Layer of ZnO by Chemical Deposition”, Proceedings of the Micro-
Electronics Symposium, 16 (2006), 347-350. (in Japanese)
4. 4) S. Otomo: “Fine Pattern on Glass Substrate”, Journal of the Surface
Finishing Society of Japan, 58-12 (2007), 53-57. (in Japanese)
5. 5) S. Deki and M. Mizuhata: “Synthesis of Metal Oxide Films Using
Liquid-Phase Deposition Methods”, Electrochemistry, 76-9 (2008),
678-686. (in Japanese)