Alloying Property of a Conductive Filler to Resolve the Re-melting Issue-Reference-Cited by-同舟云学术

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Alloying Property of a Conductive Filler to Resolve the Re-melting Issue

Published:2018 Issue:6 Volume:7 Page:260-265
ISSN:2186-702X
Container-title:Journal of Smart Processing
language:en
Short-container-title:

Author:

SUGIMOTO Kaoru¹²,YAGI Tomohisa³,HONMA Hideo²,WATANABE Mitsuhiro²

Affiliation:

1. Fujitsu Interconnect Technologies Limited, Business Development Division

2. Graduate School of Engineering, Kanto Gakuin University

3. Fujitsu Quality Laboratory Limited

Publisher

Sumart Processing Society for Minerals, Environment and Energy

Link

https://www.jstage.jst.go.jp/article/jspmee/7/6/7_260/_pdf

Reference20 articles.

1. S. K. Kang, S. Buchwalter and C. Tsang: Journal of Electronic Materials, 29-10 (2000) 1273-1283.

2. S. K. Kang and S. Puruchothaman: Proc. 48th Electronic Components and Technology Conference, 1998, p1031-1035.

3. S. K. Kang, S. L. Buchwalter, N. C. LaBianca, J. Gelorme, S. Purushothaman, K. Papathomas and M. Poliks: IEEE Transaction on Components and Packaging Technologies, 24-3 (2001) 431-435.

4. Y. Kitamura, S. Watanabe and Y. Kawanobe: Journal of DENKISEIKO, 72-4 (2001) 239-245.

5. M. Inoue and Y. Sakaniwa: Proc. IEEE 66th Electronic Components and Technology Conference, 2016, p2068-2074.

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