Thermal Warp Simulation in Substrate with Properties Change of Curing Resin-Reference-Cited by-同舟云学术

Thermal Warp Simulation in Substrate with Properties Change of Curing Resin

Published:2019 Issue:5 Volume:8 Page:184-189
ISSN:2186-702X
Container-title:Journal of Smart Processing
language:en
Short-container-title:

Author:

NAGAOKA Hideaki¹,FURUYAMA Masaharu¹,AKAHOSHI Tomoyuki¹,MIZUTANI Daisuke¹,SAKUYAMA Seiki¹,NAGATAKE Mami²,ITOH Nobutaka³

Affiliation:

1. Fujitsu Laboratories Ltd.

2. Fujitsu Advanced Technologies Ltd.

3. Technology Laboratories Ltd.

Publisher

Sumart Processing Society for Minerals, Environment and Energy

Link

https://www.jstage.jst.go.jp/article/jspmee/8/5/8_184/_pdf

Reference7 articles.

1. JEITA, “Measurements Methods of Package Warpage at Elevated Temperature and the Maximum Permissible Warpage”, JEITA ED- 7306, Japan Electronics and Information Technology Industries Association, 2007.

2. M.Ohori, C.Sato and K.Ikegami, “Viscoelastic Propertiesand Internal Stress of Thermossetting Resin in Curing Process”, JSMS, 43-484 （1994）, 18-22.

3. S.Nakamura and M.Goto, “Expedient Evaluation method of Residual Stress for Viscoelastic Laminated Bodies”, The Japan Society of Mechanical Engineers International Journal, Series A, 71-703 （2005）, 513- 519.

4. Sung-Won Kim, “Simulation of Warpage During Fabrication of Printed Cirucuit Boards”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-6（2011）, 884-892.

5. 尾崎秋子、池田徹、河原真哉、宮崎則幸、畑尾卓也、中井戸宙、小金丸正明、“電子パッケージの反りが示す熱履歴によるヒステリシス挙動の解析手法の開発、”エレクトロニクス実装学会誌、18-7（2015）, 486-494.