Integrated Inductor Model Verification for Microwave LC-filters in Si and SiGe Systems on a Chip

Author:

Erokhin V. V.1

Affiliation:

1. Omsk State Technical University

Abstract

In this paper, the conductor model that can be used to design of various inductor layout configurations for any Si and SiGe technological processes is considered. The experimental prototypes of the test inductors were produced in the standard SiGe BiCMOS 130 nm process to verify the model. The chips measuring results showed that the characteristics of the prototypes taking into account the manufacturing tolerance are in the range of model simulated values. It has been found that the proposed model has a better convergence with the prototypes characteristics than 3D modeling. The equivalent circuit simulation speed can be orders of magnitude higher than the 3D simulation speed. The proposed model accuracy is achieved by taking into account the skin-effect and edge-effects in the dielectric and substrate. Using the skin-effect equivalent circuit the model can be run in Cadence Specter Simulator. It is necessary for the microwave LC-filters development.

Publisher

Siberian State University of Telecommunications and Informatics

Reference20 articles.

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2. Ren-Jia Chan, Jyh-Chyurn Guo. Analysis and Modeling of Skin and Proximity Effects for MillimeterWave Inductors Design in Nanoscale Si CMOS. 9th European Microwave Integrated Circuit Conference, Rome, Italy, 2014, pp. 13-16.

3. F.M. Rotella, V. Blaschke, D. Howard. A Broad-Band Scalable Lumped-Element Inductor Model Using Analytic Expressions to Incorporate Skin Effect, Substrate Loss, and Proximity Effect. Digest. International Electron Devices Meeting, San Francisco, CA, USA, 2002, pp. 471-474.

4. Yu Cao, R.A. Groves, N.D. Zamdmer. Frequency-Independent Equivalent Circuit Model for On-chip Spiral Inductors. Proceedings of the IEEE 2002 Custom Integrated Circuits Conference, Orlando, FL, USA, 2002, pp. 217-220.

5. S. Kim, D.P. Neikirk. Compact Equivalent Circuit Model for the Skin Effect. IEEE MTT-S International Microwave Symposium Digest, San Francisco, CA, USA, 1996, pp. 1815-1818.

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