High Power Density Laser Diode Arrays for Solid State Laser Pump in a Wide Temperature Range
Author:
Publisher
Allerton Press
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.3103/S1068335621040072.pdf
Reference10 articles.
1. X. Liu, W. Zhao, L. Xiong, and H. Liu, Packaging of High Power Semiconductor Lasers, Micro- and Opto-Electronic Materials, Structures, and Systems (Springer, New York, 2015). https://doi.org/10.1007/978-1-4614-9263-4
2. F. Amzajerdian, B. L. Meadows, N. R. Baker, B. W. Barnes, R. S. Baggott, G. E. Lockard, U. N. Singh, and M. J. Kavaya, “Improving reliability of high power quasi-CW laser diode arrays for pumping solid state lasers,” Proc. SPIE 5887, 58870E (2005). https://doi.org/10.1117/12.620102
3. P. Rosenberg, P. Reichert, J. Du, M. Fouksman, H. Zhou, J. McNulty, S. Tolman, and C. Luong, “Highly reliable hard-soldered 1.6kW QCW laser diode stack packaging platform,” Proc. SPIE 6456, 645618 (2007). https://doi.org/10.1117/12.701303
4. E. Deichsel, D. Schröder, J. Meusel, R. Hülsewede, J. Sebastian, S. Ludwig, and P. Hennig, “High reliable QCW laser bars and stacks,” Proc. SPIE 6876, 68760K (2008). https://doi.org/10.1117/12.761476
5. B. P. Hoden, “Method for modular laser diode assembly,” US Patent No. 6 352 873 B1 (2002).
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