Electrodeposition of NiFe/Cu multilayers from a single bath
Author:
Publisher
Allerton Press
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces
Link
http://link.springer.com/content/pdf/10.3103/S1068375511020049.pdf
Reference19 articles.
1. Jyoko, Y., Kashiwabara, S., and Hayashi, Y., Characterization of Electrodeposited Co/Cu Ultrathin Films and Multilayers, J. Magn. Magn. Mater., 1997, vol. 165, pp. 280–283.
2. Haseeb, A.S.M.A., Celis, J.P., and Roos, J.R., Dual-Bath Electrodeposition of Cu/Ni Compositionally Modulated Multilayers, J. Electrochem. Soc., 1994, vol. 141, pp. 230–237.
3. Wang, W. and Singh, R.N., Fatigue Crack Growth in Ni-Sn Multilayered Composite, Mater. Sci. Eng., 1998, vol. A251, pp. 184–191.
4. Jyoko, Y., Kashiwabara, S., and Hayashi, Y., Preparation and Characterization of Electrodeposited Pt/Co Multilayers, J. Magn. Magn. Mater., 1996, vol. 156, pp. 35–37.
5. Hayashi, Y., Kashiwabara, S., and Jyoko, Y., Preparation and Characterization of Electrodeposited Metallic Multilayers, Physica, Ser. B, 1997, vol. 239, pp. 35–40.
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