Investigation and Modelling of Copper Electroforming Process for Surface Roughness Parameters Using Regression and Pareto ANOVA Analyses
Author:
Publisher
Allerton Press
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces
Link
https://link.springer.com/content/pdf/10.3103/S1068375523060066.pdf
Reference52 articles.
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2. Zhu, D. and Zeng, Y.B., Micro electroforming of high-aspect-ratio metallic microstructures by using a movable mask, CIRP Annals, 2008, vol. 57, no. 1, p. 227. https://doi.org/10.1016/j.cirp.2008.03.092
3. Chen, S.-T. and Luo, T.-S., Fabrication of micro-hole arrays using precision filled wax metal deposition, J. Mater. Process. Technol., 2010, vol. 210, no. 3, p. 504. https://doi.org/10.1016/j.jmatprotec.2009.10.013
4. Masuzawa, T., Kuo, C.L., and Fujino, M., A combined electrical machining process for micronozzle fabrication, CIRP Annals, 1994, vol. 43, no. 1, p. 189. https://doi.org/10.1016/S0007-8506(07)62193-3
5. Tajiri, K., Nakamura, T., Kabeya, Z., Yamanaka, Y., et al., Development of an electroformed copper lining for accelerator components, Electrochim. Acta, 2001, vol. 47, nos. 1–2, p. 143. https://doi.org/10.1016/S0013-4686(01)00571-0
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