1. Kondratenko, V.S., Naumov, A.S., and Velikovskiy, I.E., Taiwan Patent no. 107129739, 2018.
2. Kondratenko, V.S., Lu, H.-T., Naumov, A.S., and Velikovskiy, I.E., Laser cutting of Taiko silicon substrates, Prikl. Fiz., 2020, no. 1, pp. 71–74.
3. Lu, H.-T., Kondratenko, V.S., Naumov, A.S., Velikovskii, I.E., and Zobov, A.K., New technology of laser cutting of silicon substrates Taiko, Sbornik dokladov konferentsii Opticheskie tekhnologii, materialy i sistemy (Optotekh-2019) (Proc. Conf. on Optical Technologies, Materials, and Systems, Optotekh-2019), Kondratenko, V.S., Ed., Moscow: MIREA–Ross. Tekhnol. Univ., 2019, pp. 16–24.
4. Murakami, R., Nakagawa, H., and Matsuo, S., Water-assisted laser drilling for miniature internal thread in glass and evaluation of its strength, J. Laser Micro Nanoeng., 2017, vol. 12, no. 3, pp. 203–206.
5. Arai, Ya., Sako, T., and Takebayashi, Yo., Supercritical Fluids: Molecular Interactions, Physical Properties and New Applications, Springer Series in Materials Processing, Berlin: Springer, 2002. https://doi.org/10.1007/978-3-642-56238-9