Fabrication Process for Low-<i>T</i><sub>c</sub> Superconductor Electronics Devices and Its Future Prospects-Reference-Cited by-同舟云学术

Fabrication Process for Low-T_c Superconductor Electronics Devices and Its Future Prospects

Published:2017 Issue:5 Volume:52 Page:315-322
ISSN:0389-2441
Container-title:TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
language:en
Short-container-title:TEION KOGAKU

Author:

HIDAKA Mutsuo¹,NAGASAWA Shuichi¹

Affiliation:

1. National Institute of Advanced Industrial Science and Technology

Publisher

Cryogenic Association of Japan

Link

https://www.jstage.jst.go.jp/article/jcsj/52/5/52_315/_pdf

Reference40 articles.

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3. 3) S. Nagasawa, et al.: “A 380ps, 9.5mW Josephson 4-Kbit RAM operated at a high bit yield”, IEEE Trans. Appl. Supercond. 5 (1995) 2447-2452

4. 4) T. Imamura, et al.: “Fabrication of high quality Nb/AlOx-Al/Nb Josephson junctions: I-Sputtered Nb films for junction electrodes”, IEEE Trans. Appl. Supercond. 2 (1992) 1-14

5. 5) N. Takeuchi, et al.: “Adiabatic quantum-flux-parametron cell library designed using a 10 kA/cm² niobium fabrication process”, Supercond. Sci. Technol. 30 (2017) 035002

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