RF and Crosstalk Characterization of Chip Interconnects Using Finite Element Method
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Published:2023
Issue:01
Volume:30
Page:
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ISSN:0971-4588
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Container-title:Indian Journal of Engineering and Materials Sciences
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language:
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Short-container-title:IJEMS
Publisher
CSIR-National Institute of Science Communication and Policy Research (NIScPR)
Subject
General Engineering,General Materials Science