Design of HTSC Undulator Magnet Array Based on Simulation of Magnetization Process-Reference-Cited by-同舟云学术

Design of HTSC Undulator Magnet Array Based on Simulation of Magnetization Process

Published:2015 Issue:1 Volume:2 Page:34-43
ISSN:2188-5303
Container-title:Journal of Advanced Simulation in Science and Engineering
language:en
Short-container-title:JASSE

Author:

Deri Yi¹,Tanaka Fumiya¹,Kawaguchi Hideki¹,Tsuchimoto Masanori²

Affiliation:

1. Division of Information and Electronic Engineering, Graduate School of Engineering, Muroran Institute of Technology

2. Department of Electrical and Digital System Engineering, Hokkaido Institute of Technology

Publisher

Japan Society for Simulation Technology

Subject

General Engineering

Reference8 articles.

1. [1] T. Ki, R. Kinjo: Application of Bulk High-temperature Superconductor ton Insertion Device for synchrotron radiation, TEION KOGAKU, 46:3 (2011), 118-124. (in Japanese)

2. [2] T. Ki et al.: Conceptual Design of a Novel Insertion Device using Bulk Superconducting Magnet, Physica C, 471 (2011), 897-900.

3. [3] T. Sugiura, H. Hashizume, K. Miya: Numerical electromagnetic field analysis of type-II superconductors, Int. J. Appl. Electromag. in Materials, 2:3 (1991), 183-196.

4. [4] M. Tsuchimoto, H. Takashima: Two-dimensional stress distributions in disk and ring high-Tc superconductors, Jpn. J. Appl. Phys, 39 (2000), 5816-5821.

5. [5] M. Tsuchimoto, K. Demachi, I. Itoh: Numerical evaluation of uniform magnetic field within superconducting Swiss roll, Physica C, 412-414 (2004), 719-722.

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