Comparison of residual monomer amounts released from indirect bonding adhesives

Author:

Hezenci Yasin,Akdeniz Berat Serdar

Abstract

ABSTRACT Objectives To quantify the amount of residual monomer released from orthodontic adhesives used in the indirect bonding technique and compare it to a direct bonding composite resin. Materials and Methods Five hundred stainless steel orthodontic brackets were bonded on bovine incisors using five groups of bonding resins: Transbond XT (TXT), Transbond Supreme LV (SLV), Sondhi Rapid-Set (SRS), Transbond IDB (IDB), and Custom I.Q. (CIQ). Liquid samples were gathered on the first, seventh, 21st, and 35th days. Residual monomer release was measured from the liquid samples with a liquid chromatography device. In addition, the amount and shape of the adhesive between the tooth surface and the bracket base was evaluated using obtained electron microscopy images. The data were analyzed using analysis of variance, and a Tukey post-hoc test was applied. Results Hydroxyethylmethacrylate and bisphenol A-glycidyl methacrylate monomers were released by all study groups. Urethane-dimethacrylate was released from the TXT, SLV, IDB, and CIQ groups. Triethylene glycol dimethacrylate was released from TXT, SLV, IDB, and SRS groups. The amount of total monomer release was higher in chemically cured adhesives than in light-cured adhesives. Among the chemically cured adhesives, premix adhesives had the highest amount of total monomer release. The light-cured adhesives had less thickness. Conclusions Light-curing adhesives have significantly less monomer release than chemically polymerized adhesives.

Publisher

The Angle Orthodontist (EH Angle Education & Research Foundation)

Subject

Orthodontics

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3