Effect of short curing times with a high-intensity light-emitting diode or high-power halogen on shear bond strength of metal brackets before and after thermocycling
Author:
Publisher
The Angle Orthodontist (EH Angle Education & Research Foundation)
Subject
Orthodontics
Link
http://www.angle.org/doi/pdf/10.2319/071810-412.1
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental Bracket Design Performance on Bonding and Polymerization of Orthodontic Composite;BioMed Research International;2024-01
2. Debonding Stresses of Metal Orthodontic Brackets Retained to Tooth Enamel with Co-Cured Self-Etch Primer;2023-09-29
3. An In-Vitro Comparison of Shear Bond Strength and Adhesive Remnant Score Between Two Color Change Adhesives in Orthodontic Bonding With Reduced Curing Time Using Different High-Intensity Light Emitting Diode Units;Cureus;2023-06-25
4. Impact of a High-Power Light-Emitting Diode Unit With Reduced Curing Times on the Shear Bond Strength of Orthodontic Brackets and Their Adhesive Remnant Index Scores;Cureus;2023-06-02
5. Exploration and preliminary clinical investigation of an adhesive approach for primary tooth restoration;The Journal of Biomedical Research;2023
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