Analysis of Structural Information from Aftershock Clouds—A Case Study of the 2008 Ms 8.0 Wenchuan Earthquake

Author:

Tian Tian1,Jingfa Zhang1,Wenliang Jiang1ORCID

Affiliation:

1. 1National Institute of Natural Hazards, Ministry of Emergency Management of the People’s Republic of China, Beijing, China

Abstract

Abstract We present a method to quantitatively analyze the characteristics of clusters and extract cluster centers in aftershock clouds to study the corresponding structural information. Based on a cluster center approach, a 3D rupture surface is constructed based on the aftershocks of the Wenchuan earthquake. The geometric characteristics of the rupture surfaces show that the Longmenshan fault zone should be divided into seven segments from south to north, and for most of the rupture surfaces, there are two discontinuities at depths of 10 and 20 km. According to the cluster characteristic distance of each rupture branch, the number of aftershocks within the cluster distance is counted. The statistical results show that 22% of the aftershocks of the Wenchuan earthquake occurred on the rupture surface parallel to the main fault and that the rest occurred along other nonparallel rupture surfaces or were scattered. The complex branches of rupture surfaces and the existence of rupture surfaces penetrating the 10 km deep discontinuity layer are two common characteristics of the XI intensity area. The change in tendency of the fracture surface between depths of 10 and 20 km may restrain the continued northward extension of the XI intensity area.

Publisher

Seismological Society of America (SSA)

Subject

Geophysics

Reference29 articles.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3