Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate-Reference-Cited by-同舟云学术

Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate

Published:2023-06-16 Issue:1 Volume:12 Page:20230003
ISSN:2379-1365
Container-title:Materials Performance and Characterization
language:en
Short-container-title:Matls. Perf. Charact.

Author:

Hu Tianhan¹,Li Zhen¹,Wu Guanzhi¹,Li Shun¹,Ding Kai²,Gao Yulai¹³

Affiliation:

1. State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, 99 Shangda Rd., Shanghai 200444, PR China

2. State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, 99 Shangda Rd., Shanghai 200444, PR China (Corresponding author), e-mail: dingkaiwsj@shu.edu.cn

3. Shanghai Engineering Research Center for Metal Parts Green Remanufacture, Shanghai University, 99 Shangda Rd., Shanghai 200444, PR China (Corresponding author), e-mail: ylgao@shu.edu.cn, https://orcid.org/0000-0001-9732-5490

Publisher

ASTM International

Subject

Metals and Alloys,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites

Reference47 articles.

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2. Evolutions of the Interface and Shear Strength between SnAgCu-xNi Solder and Cu Substrate during Isothermal Aging at 150°C;Liu;Journal of Alloys and Compounds,2009

3. Effects of Zn Addition on Mechanical Properties of Eutectic Sn-58Bi Solder during Liquid-State Aging;Ma;Transactions of Nonferrous Metals Society of China,2015

4. Growth Behavior and Microstructure of Intermetallics at Interface of AuSn20 Solder and Metalized-Ni Layer;Wei;Transactions of Nonferrous Metals Society of China,2017

5. Reliability Issues of Lead-Free Solder Joints in Electronic Devices;Jiang;Science and Technology of Advanced Materials,2019

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