The Effect of Reflow Temperature on Time at the End of Gravity Zone (Tgz) of Sn-3.8Ag-0.7Cu Solder Alloy-Reference-Cited by-同舟云学术

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The Effect of Reflow Temperature on Time at the End of Gravity Zone (Tgz) of Sn-3.8Ag-0.7Cu Solder Alloy

Published:2020-01-01 Issue:1 Volume:9 Page:20190230
ISSN:2379-1365
Container-title:Materials Performance and Characterization
language:en
Short-container-title:Matls. Perf. Charact.

Author:

Panikar Ramanandan Santhanu¹,Skanda V. Amogha¹,Tikale Sanjay¹,Prabhu K. Narayan²

Affiliation:

1. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, N.H-66, Surathkal, Mangalore 575025, India

2. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575025, India (Corresponding author), e-mail: prabhukn_2002@yahoo.co.in, https://orcid.org/0000-0002-8359-2587

Publisher

ASTM International

Subject

Metals and Alloys,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints;Journal of Manufacturing Processes;2022-11

2. Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions;Materials Science and Technology;2022-03-21

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