Digital Image Correlation Measuring of Strain and Stress Distributionon Mixed Adhesive Joints Bonded by Honeymoon Adhesion Using TwoTypes of Second-Generation Acrylic Adhesives of Two Components-Reference-Cited by-同舟云学术

Digital Image Correlation Measuring of Strain and Stress Distributionon Mixed Adhesive Joints Bonded by Honeymoon Adhesion Using TwoTypes of Second-Generation Acrylic Adhesives of Two Components

Published:2017-06-01 Issue:6 Volume:53 Page:192-201
ISSN:0916-4812
Container-title:Journal of The Adhesion Society of Japan
language:en
Short-container-title:

Author:

KAWASAKI Shota¹,SEKIGUCHI Yu²,NAKAJIMA Gosuke³,HARAGA Kosuke⁴,SATO Chiaki²

Affiliation:

1. Department of Mechano-Micro Engineering, Tokyo Institute ofTechnology

2. Institute of Innovative Research, Tokyo Institute of Technology

3. Electronic Materials Research Department, Shibukawa Plant,Denka Company Limited

4. HARAGA Adhesion Technology Consulting Co., Ltd.

Publisher

The Adhesion Society of Japan

Link

https://www.jstage.jst.go.jp/article/adhesion/53/6/53_192/_pdf

Reference22 articles.

1. 1) R. D., Adams, J. Comyn, W. C. Wake, “Structural AdhesiveJoints in Engineering 2nd ed.”, Chapman & Hall, p. 1 (1997).

2. 2) A. J. Kinloch, “Adhesion and Adhesives: Science and Technology”,Chapman & Hall, London, p. 1 (1987).

3. 3) L. F. M. da Silva, A. Oechsner, R. D. Adams, “Handbook of AdhesionTechnology”, Springer, p. 2 (2011).

4. 4) L. J. Hart-smith, NASA CR-112237 (1973).

5. 5) C. Raphael, Appl. Polym. Symp., 3, 99 (1966).

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